SMT Industry

SMT (Surface Mount Technology) is one of the most popular technologies and processes in the electronics assembly industry. The harm of moisture to the semiconductor industry is mainly manifested in the fact that moisture can penetrate into the IC through the IC plastic package and from the gaps of the pins, and the pressure generated causes the IC to absorb moisture.

In the heating process of the SMT process, moisture entering the inside of the IC is thermally expanded to form water vapor, and the generated pressure causes cracking of the IC resin package and oxidation of the metal inside the IC device, resulting in product failure, furthermore, when the device is soldered on the PCB. During the process, due to the release of water vapor pressure, it also leads to pseudo soldering.

According to the IPC-M190 J-STD-033 standard, SMT components exposed to high-humidity air must be placed in an dry cabinet below 10% RH humidity for 10 times of the exposure time to restore the components. Only in this way the “workshop life” of components can be restored to avoid scrapping and ensure safety.For unsealed MSD, when the exposure time does not exceed 72 hours, it can be stored at specified humidity storage(such as 10% RH or 5% RH or less) for 5 times or 10 times to restore the service life of the MSD.